Bare PCB/FPC

    Layer count

    1 ~ 64layers

    Laminates type

    FR-4(High Tg, Halogen Free, High Frequency)

    FR-5, CEM-3, PTFE, BT, Getek, Aluminium base,Copper base,KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon

    Board thickness

    6-240mil

    Max Base copper weight

    210um (6oz) for inner layer 210um (6oz) for outer layer

    Min mechanical drill size

    0.2mm (0.008")

    Aspect ratio

    12 : 1

    Max panel size

    Sigle side or double sides:500mm*1200mm,

    Multilayer layers:508mm X 610mm (20" X 24")

    Min line width/space

    0.076mm / 0.0.076mm (0.003" / 0.003")

    Via hole type

    Blind / Burried / Plugged(VOP,VIP…)

    HDI / Microvia

    YES

    Surface finish

    HASL

    Lead Free HASL

    Immersion Gold (ENIG), Immersion Tin, Immersion Silver

    Organic Solderability Preservative (OSP) / ENTEK

    Flash Gold(Hard Gold plating)

    ENEPIG

    Selective Gold Plating, Gold thickness up to 3um(120u")

    Gold Finger, Carbon Print, Peelable S/M

    Solder mask color

    Green, Blue, White, Black, Clear, etc.

    Impedance

    Single trace,differential , coplanar impedance controlled ±10%

    Outline finish type

    CNC Routing; V-Scoring / Cut; Punch

    Tolerances

    Min Hole tolerance (NPTH)

    Min Hole tolerance (PTH)

    Min Pattern tolerance

    ±0.05mm

    ±0.075mm

    ±0.05mm